Strategies for Hybrid Integration and Packaging at Millimeter-Wave and THz Frequencies

By Yunfeng Dong

With the ever increasing demand worldwide for high-speed data transmission, the bit-rates for data transmission are accelerating and the next migration to 1 Tbit/s should take place in the near future. At millimeter-wave and terahertz frequencies, some minor or negligible problems at lower frequencies become significant at system-on-package (SOP) level and they challenge the existing technologies and strategies for hybrid integration and packaging.

The purpose of this project is to develop innovative strategies that are suitable for hybrid integration and packaging at millimeter-wave and terahertz frequencies. The development will include hybrid integration for wideband signal transmission, packaging technologies, and integrated electronics for terahertz signal detection and generation including on-chip antennas as an alternative packaging approach.

The future high-speed data transmission systems at millimeter-wave and terahertz frequencies will benefit from the developed innovative strategies for hybrid integration and packaging.

To be completed: 2019